Collaborations

The EECIS collaborates with both academic (ETH, Univ. Paris-Saclay, Fraunhofer-Gessellschaft, Univ. Michigan, Univ. Dellaware, KAIST) and industry partners.

For example, the Functional Inorganic Materials group (D-CHAB), EMPA and the EECIS has formed a research consortium to develop a 3-D stacked image sensor using perovskite photodetector on a CMOS integrated circuits.

For a synergetic application of the ultra-low-power circuits and systems, the EECIS is collaborating internally with Prof. Vörös and Prof. Yanik to develop novel neural recording systems.

Also, the EECIS is a member of international and interdisciplinary collaboration composed of groups from the Univ. of Delaware, Univ. of Michigan and the ETH. Through this collaboration, we have presented the world’s smallest neural recording probe, size of 0.03mm2.

Researches on the smart edge node using analog in-memory computing is planned with Fraunhofer and IBM Zurich. Internal collaborations with Prof. Benini and Prof. Huang are on-going for the ultra-low power interface and communications.